SAN FRANCISCO, United States – Teledyne Judson Technologies has expanded its advanced imaging portfolio with the introduction of the SCION Family of SWIR cameras, reinforcing Teledyne Technologies’ position as a global leader in vertically integrated sensing solutions for scientific, industrial, and defense applications.
Built to address the increasing demand for high-speed, high-sensitivity infrared imaging, the SCION platform offers a standardized yet flexible camera architecture featuring 10-micron pixels and resolutions up to 1,280 × 1,024. The design targets applications where rapid data acquisition, spectral versatility, and cost efficiency are essential, including hyperspectral systems, bioscience research, semiconductor manufacturing, and space-based observation.
At the core of the SCION platform are Teledyne’s proprietary sensor materials, VisGaAs and MCT, which provide extended sensitivity across visible and short-wave infrared wavelengths. With coverage ranging from 300 to 2,500 nm, the cameras are suited for tasks such as fluorescence imaging, environmental monitoring, and precision defect inspection.
According to Paul Mark, Director of Infrared and Spectroscopy at Teledyne Judson Technologies, the platform reflects a deliberate focus on integration and usability. “SCION brings together low-noise sensor performance, thermoelectric cooling, and advanced readout techniques in a single, scalable platform,” he said. “This allows customers to deploy high-performance SWIR imaging without the complexity typically associated with custom systems.”
A key feature of the SCION cameras is their SUPR readout mode, which significantly reduces noise and enables accurate signal capture even in low-light conditions. This capability supports measurement-intensive applications where stability and repeatability are critical.
From a manufacturing and deployment perspective, SCION leverages Teledyne’s vertically integrated model. By designing and producing components from the sensor through the camera electronics and software interfaces, the company reduces supply-chain risk while optimizing total cost of ownership for end users.
Teledyne will present the SCION platform at leading industry exhibitions in 2026, offering live demonstrations to showcase its imaging performance and modular architecture. These events are expected to attract researchers, system integrators, and industry partners seeking next-generation infrared solutions.
With the introduction of SCION, Teledyne Vision Solutions—encompassing brands such as Teledyne DALSA, FLIR IIS, Photometrics, Princeton Instruments, and Judson Technologies—continues to expand what it describes as the world’s most comprehensive imaging technology portfolio. The new camera family is expected to play a key role in advancing infrared imaging capabilities across both established and emerging markets.
Source : globenewswire.com
